ELETM公司首創(chuàng)的銀基鍵合絲,基于5N以上的高純銀,通過專有的合金化鑄造和加工技術(shù),解決了銀鋁中間化合物擴(kuò)散過快和性能退化的問題,并大大增強(qiáng)了抗腐蝕能力,是金絲的最佳替代品。
n特點(diǎn)/Characteristics
Type | YA1 | YA2 | YA3 | YA4 |
Main content | Ag≥99.0% AuPd≤1.0% | Ag≥95.0% AuPd≤5.0% | Ag≥88.0% AuPd≤12.0% | Ag≥85.0% AuPd≤15.0% |
Characteristics | 電阻率低,熱傳導(dǎo)率高 | 抗疲勞性好 | 抗腐蝕性好 | 可靠性高 |
n機(jī)械性能/Mechanical properties
Diameter | B/L(gf) | E/L(%) | ||||
μm | mil | YA1 | YA2 | YA3 | YA4 | YA |
15±1 | 0.6 | >1.5 | >2 | >3 | >4 | 2 - 10 |
16±1 | 0.65 | >2 | >3 | >4 | >5 | 2 - 10 |
18±1 | 0.7 | >4 | >5 | >6 | >7 | 5 - 15 |
20±1 | 0.8 | >5 | >6 | >7 | >8 | 5 - 15 |
23±1 | 0.9 | >7 | >8 | >10 | >11 | 5- 15 |
25±1 | 1.0 | >9 | >10 | >12 | >13 | 5- 15 |
30±1 | 1.2 | >13 | >14 | >15 | >16 | 8- 18 |
32±1 | 1.25 | >15 | >16 | >17 | >18 | 8 - 18 |
38±1 | 1.5 | >20 | >21 | >22 | >23 | 10 - 20 |
50±2 | 2.0 | >34 | >36 | >38 | >40 | 10 - 20 |
75±3 | 3.0 | >68 | >70 | >75 | >78 | 15 - 25 |
n應(yīng)用范圍/Applications Of Ag Bonding Wires
YA1 | YA2 | YA3 | YA4 |
常規(guī) | LED QFN TSOP Flash Memo | LEDPBGAQFPTQFPTSSOPBGAQFNFlash MemoDFN IC CARD MQFP
| TQFP |
n抗腐蝕性能/Corrosion Resistance
n熔斷電流、硬度/Fusing Current & Hardnes
Type | YA1 | YA2 | YA3 | YA4 | ||
μm | mil | |||||
Fusing Current | 18 | 0.7 | 0.38 | 0.35 | 0.32 | 0.30 |
20 | 0.8 | 0.49 | 0.45 | 0.42 | 0.39 | |
23 | 0.9 | 0.62 | 0.57 | 0.53 | 0.48 | |
25 | 1.0 | 0.76 | 0.70 | 0.64 | 0.61 | |
30 | 1.2 | 1.07 | 0.99 | 0.91 | 0.89 | |
38 | 1.5 | 1.66 | 1.54 | 1.42 | 1.37 | |
50 | 2.0 | 2.91 | 2.74 | 2.52 | 2.43 | |
Hardness | Wire | 56-61 | 59-64 | 61-66 | 63-68 | |
FAB | 50-55 | 53-58 | 55-59 | 56-60 |
n可靠性/Reliability